STMicroelectronics Moves Forward in Developing Cutting-Edge Semiconductor Fabrication Technology
STMicroelectronics Announces Next-Generation Panel-Level Packaging Technology
STMicroelectronics, a global leader in semiconductor technology, is pushing the boundaries of innovation with its development of the next generations of Panel-Level Packaging (PLP) technology. This ambitious project, centred around Direct Copper Interconnect (DCI) technology, is set to revolutionise the electronics industry.
The company's journey with PLP-DCI technology began in 2020, and since then, STMicroelectronics has been at the forefront of its development. The next phase of this groundbreaking technology is being developed at the company's Tours site in France, with a pilot production line slated to become operational in Q3 2026.
This significant undertaking involves an investment of over $60 million, a testament to STMicroelectronics' commitment to driving technological advancements. The PLP-DCI process developed by STMicroelectronics is currently operational on a highly automated line, and the company has already achieved a state-of-the-art PLP-DCI process in production at high volumes of over 5 million units per day.
The PLP technology, a sophisticated, automated chip packaging and test process, packages multiple Integrated Circuits (ICs) on a single, larger rectangular substrate panel. This approach improves throughput and reduces costs, making it an attractive solution for high-volume production.
In the PLP-DCI process, STMicroelectronics uses very large, 700x700mm panels for manufacturing efficiency. This size allows for higher manufacturing throughput, making it more efficient for high-volume production. The DCI process offers superior performance compared to traditional methods that use solder bumps, with benefits including reduced power losses, enhanced heat dissipation, and miniaturization.
The new PLP technology is expected to enable better overall power density due to reduced power losses. This is particularly beneficial for applications that require high power density, such as automotive, industrial, and consumer electronics.
The development of the new PLP pilot line in Tours is supported by a multidisciplinary team of experts. This program is focused on advanced manufacturing infrastructure and brings redefined missions for some sites in France and Italy to support their long-term success.
Furthermore, the new PLP pilot line in Tours will be a key part of a larger strategic initiative focused on heterogeneous integration. This initiative is expected to create additional synergies with the local R&D ecosystem, including the CERTEM R&D center.
STMicroelectronics plans to develop the next generations of its PLP technology for various applications, including automotive, industrial, and consumer electronics. The company's commitment to innovation and its focus on advanced packaging technologies like PLP-DCI position it well for the future of the electronics industry.
