Detailed Explanation of VITA 93 Quick Mezzanine Card
News Article: VITA 93 QMC Modules Offer Flexible Cooling Solutions for Industrial Applications
VITA 93 QMC, a new mezzanine card standard, is making waves in the industry by extending beyond its traditional use in military and avionics applications. This standard is designed for rugged or industrial applications, providing a versatile solution for various demands, particularly those with shock and vibration challenges.
One of the key aspects of VITA 93 QMC is its cooling standards, which offer flexibility to suit different system requirements. The modules can be either convection-cooled (air-cooled) or conduction-cooled, providing designers with the freedom to choose the most suitable cooling method for their specific application.
Convection cooling is the default and simplest approach, suitable for many applications. It relies on the natural movement of air to dissipate heat from the module. On the other hand, conduction cooling offers higher cooling capability but requires additional hardware such as heatsinks or cold plates. The design of the conduction cooling structure is left to the carrier board designer, as long as the specified mechanical envelopes are respected.
A thermal interface material (TIM) is used between the module's heatsink and the carrier board's heatsink to ensure efficient heat dissipation. The VITA 93 QMC standard provides mechanical envelope and mounting hardware specifications that support conduction-cooled modules with pre-mounted heatsinks like skyline heatsinks.
Cooling solutions for VITA 93 QMC modules are designed to accommodate rugged environments, making them suitable for industrial and commercial applications. They are built to fit in cramped locations and can be convection- or conduction-cooled, depending on the system's needs.
The stacking height of VITA 93 QMC modules is based on the socket on the carrier board, and while stacking of these modules is possible, the standard does not provide specific guidelines for this process. However, the standard ensures interoperability and thermal management compatibility, making it an ideal choice for complex, multi-layered systems.
The connector used in VITA 93 QMC is rated up to 64-Gb/s PAM4, making it suitable for high-speed serial interfaces like PCI Express Gen 6 and the Compute Express Link (CXL) standard. This high-speed capability, combined with the standard's flexibility and suitability for industrial applications, makes VITA 93 QMC a compelling choice for designers seeking a robust, versatile solution for their next project.
[1] VITA 93 QMC Standard Overview [2] VITA 93 QMC Mechanical and Thermal Considerations [3] VITA 93 QMC Thermal Management Guidelines [4] VITA 93 QMC Cooling Solutions
- The VITA 93 QMC standard, designed for rugged or industrial applications, strikes a chord with designers who work in data-and-cloud-computing, embedded systems, and technology, thanks to its versatility for various demands and high-speed serial interface compatibility up to 64-Gb/s PAM4.
- Incorporating VITA 93 QMC technology into industrial or commercial applications allows for the use of cooling solutions designed for rugged environments, with modules that can be either convection-cooled or conduction-cooled, providing the required flexibility for diverse system requirements.
